Mechanical Simulation Engineer – Advanced Packaging
Micron
Mechanical Simulation Engineer – Advanced Packaging at Micron is a full time role based in Hyderabad - Phoenix Aquila, India. It was published on 6 August 2026 and was open at last check.
| Role | Mechanical Simulation Engineer – Advanced Packaging |
|---|---|
| Company | Micron |
| Location | Hyderabad - Phoenix Aquila, India |
| Employment type | Full Time |
| Published | 6 August 2026 |
| Status | Open at last check |
Our vision is to transform how the world uses information to enrich life for all.
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
As a Mechanical Simulation Engineer, you will drive thermo-mechanical and multiphysics modeling for advanced semiconductor packaging technologies including HBM, 2.5D, and 3D integration. The role focuses on enabling robust package design through advanced simulation, material characterization, and failure mechanism understanding. You will actively integrate Generative AI, AI Assistant tools, and broader Artificial Intelligence capabilities to optimize modeling workflows, enhance predictive analytics, and automate complex simulations. This includes leveraging AI to improve simulation accuracy, reduce cycle time, and enable advanced modeling capabilities. You will collaborate with cross-functional teams across package architecture, fabrication, and assembly process integration to develop predictive simulation methodologies and influence design decisions.
Job Responsibilities:
Perform linear and non-linear static analysis for package and material behavior
Conduct fatigue, fracture mechanics, and reliability simulations for advanced packages
Develop multiphysics models (thermo-mechanical, thermal, structural, fluidic)
Model interfaces including contact, shear, delamination, and interfacial damage
Integrate Generative AI, AI Assistant tools, and Artificial Intelligence for simulation acceleration and optimization
Apply AI/ML techniques for surrogate modeling, reduced-order modeling, and design optimization
Develop and deploy automation workflows for simulation setup, solve, and post-processing
Leverage data-driven methods to enhance model fidelity and reduce turnaround time
Support development of HBM, 2.5D/3D packages, TSV, and hybrid bonding technologies
Understand fabrication and assembly processes such as thermo-compression bonding, reflow, and wafer bonding
Develop material models for polymers, composites, and thin-film stacks
Drive material characterization workflows and validation
Perform failure and reliability analysis including fatigue life and crack propagation
Collaborate with global cross-functional teams
Experience:
2-5 years of experience in Mechanical/Materials engineering within semiconductor or advanced packaging domains, with experience in AI-driven modeling, automation, or data-driven simulation techniques preferred.
About Micron Technology, Inc.
We are an industry leader in innovative memory and storage solutions transforming how the world uses information to enrich life for all . With a relentless focus on our customers, technology leadership, and manufacturing and operational excellence, Micron delivers a rich portfolio of high-performance DRAM, NAND, and NOR memory and storage products through our Micron® and Crucial® brands. Every day, the innovations that our people create fuel the data economy, enabling advances in artificial intelligence and 5G applications that unleash opportunities — from the data center to the intelligent edge and across the client and mobile user experience.
To learn more, please visit micron.com/careers
All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, veteran or disability status.
To request assistance with the application process and/or for reasonable accommodations, please contact hrsupport_india@micron.com
Micron Prohibits the use of child labor and complies with all applicable laws, rules, regulations, and other international and industry labor standards.
Micron does not charge candidates any recruitment fees or unlawfully collect any other payment from candidates as consideration for their employment with Micron.
AI alert: Candidates are encouraged to use AI tools to enhance their resume and/or application materials. However, all information provided must be accurate and reflect the candidate's true skills and experiences. Misuse of AI to fabricate or misrepresent qualifications will result in immediate disqualification.
Fraud alert: Micron advises job seekers to be cautious of unsolicited job offers and to verify the authenticity of any communication claiming to be from Micron by checking the official Micron careers website in the About Micron Technology, Inc.
Create your free OnJob profile to apply — we'll take you to Micron's application after sign-up. · Posted 6 Aug 2026.
Mechanical Simulation Engineer – Advanced Packaging at Micron — questions answered
What does the Mechanical Simulation Engineer – Advanced Packaging role at Micron pay?
Micron does not publish a salary on this Mechanical Simulation Engineer – Advanced Packaging listing, so OnJob shows no figure for it rather than an estimate. For what this role pays across the market, the OnJob salary guides aggregate the live listings that do disclose pay.
Where is the Mechanical Simulation Engineer – Advanced Packaging role at Micron based?
Micron lists this Mechanical Simulation Engineer – Advanced Packaging role in Hyderabad - Phoenix Aquila, India, advertised as full time work at that location. Larger employers sometimes cover several sites under one city name, so confirm the exact office with Micron before you apply.
Is the Mechanical Simulation Engineer – Advanced Packaging role at Micron still open?
The Mechanical Simulation Engineer – Advanced Packaging posting at Micron was open at OnJob's last check of the employer's careers page, having been published on 6 August 2026. OnJob re-checks source listings on each build and marks a role closed once it disappears, but listings can close without notice, so the employer's own page is the final word.
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