<2026 Internship Program> Process Engineer Intern (Wire Bonding)
NXP Semiconductors
<2026 Internship Program> Process Engineer Intern (Wire Bonding) at NXP Semiconductors is a full time role based in Kaohsiung, Taiwan. It was published on 3 June 2026 and was open at last check.
| Role | <2026 Internship Program> Process Engineer Intern (Wire Bonding) |
|---|---|
| Company | NXP Semiconductors |
| Location | Kaohsiung, Taiwan |
| Employment type | Full Time |
| Published | 3 June 2026 |
| Status | Open at last check |
- To work with operation/maintenance to ensure production smoothly.
- To assist action confirmations with system monitors.
- To work with Engineers for yield improvements from the study of stable plasma cleaning as the leading indicator.
Job Qualification:
- Understanding of Plasma cleaning principle for wire bonding Integrity Chip die pad/wire type/Lead-post structures
- Bachelor's or Master's student in Material/Science/Electronic Engineering or related
- Available to work at least 3 days/week.
- Good verbal and written English communication skills
- MS Office or Programming skill
- Self-motivated, results oriented, willing and eager to learn, proactive attitude
Create your free OnJob profile to apply — we'll take you to NXP Semiconductors's application after sign-up. · Posted 3 Jun 2026.
<2026 Internship Program> Process Engineer Intern (Wire Bonding) at NXP Semiconductors — questions answered
What does the <2026 Internship Program> Process Engineer Intern (Wire Bonding) role at NXP Semiconductors pay?
NXP Semiconductors does not publish a salary on this <2026 Internship Program> Process Engineer Intern (Wire Bonding) listing, so OnJob shows no figure for it rather than an estimate. For what this role pays across the market, the OnJob salary guides aggregate the live listings that do disclose pay.
Where is the <2026 Internship Program> Process Engineer Intern (Wire Bonding) role at NXP Semiconductors based?
NXP Semiconductors lists this <2026 Internship Program> Process Engineer Intern (Wire Bonding) role in Kaohsiung, Taiwan, advertised as full time work at that location. Larger employers sometimes cover several sites under one city name, so confirm the exact office with NXP Semiconductors before you apply.
Is the <2026 Internship Program> Process Engineer Intern (Wire Bonding) role at NXP Semiconductors still open?
The <2026 Internship Program> Process Engineer Intern (Wire Bonding) posting at NXP Semiconductors was open at OnJob's last check of the employer's careers page, having been published on 3 June 2026. OnJob re-checks source listings on each build and marks a role closed once it disappears, but listings can close without notice, so the employer's own page is the final word.
How do you apply for the <2026 Internship Program> Process Engineer Intern (Wire Bonding) role at NXP Semiconductors?
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